- - Each metallic impurity level guaranteed to be 10 ppt or less.
- - TAMAPURE-AA-10 is the further purified reagent of TAMAPURE-AA-100.
- - Open and use in a clean environment of CLASS 10 or higher.
| Item | Concentration | Unit Packing |
|---|---|---|
| Hydrofluoric Acid (HF) | 38% | 500gr |
| Hydrochloric Acid (HCl) | 20% | 500gr |
| Nitric Acid (HNO3) | 68% | 500gr |
| Nitric Acid (For overseas) | 55% | 500gr |
| Hydrogen Peroxide (H2O2) | 35% | 500gr |
- - Each metallic impurity level guaranteed to be 100 ppt or less.
- - Open and use in a clean environment of CLASS 100 or higher.
| Item | Concentration | Unit Packing |
|---|---|---|
| Hydrofluoric Acid (HF) | 38% | 500gr |
| Hydrochloric Acid (HCl) | 20% | 500gr |
| Hydrochloric Acid (HCl) | 30% | 500gr |
| Nitric Acid (HNO3) | 68% | 500gr |
| Nitric Acid (For overseas) | 55% | 500gr |
| Sulfuric Acid (H2SO4) | 98% | 250gr |
| Hydrogen Peroxide (H2O2) | 35% | 500gr |
Ultrapure Water is used for the cleaning of instruments and containers in trace analysis and for dilution of samples.
TAMAPURE-AA Ultrapure Water has a metal impurity of ppt levels or less, and allows you to obtain more reliable analytical values due to the minimization of blank values.
- - Each metallic impurity level guaranteed to be 10 ppt or less.
- - Open and use in a clean environment of CLASS 10 or higher.
- - Unit Packing: 500 grams
TMAH is the abbreviation of Tetramethyl Ammonium Hydoxide (chemical formula (CH3)4NOH) and its aqueous solution is a strong alkali.
In preparation of analytical samples, it is very effective in the trace analysis of elements that are liable to become volatile with acid-digestion. In addition, compared to conventional alkali digestion using NaOH or KOH, the use of TMAH enables more accurate determination due to its smaller matrix effect.
- - Each metallic impurity level guaranteed to be 1000 ppt or less.
- - Use after opening in a clean environment such as a clean room.
- - Concentration: 25%
- - Unit packing: 500 grams
TAMAPURE-AA SSX is pre-mixed scanning solution for wafer surface analysis. This analysis process involves sample preparation using VPD or other methods, taking up into solution using DADD or other methods. Next trace metals are measured in the scanning solution using GFAAS, ICPMS, or TXRF. This new product was developed to improve the reliability and efficiency of wafer surface trace metal analysis.
SSX is a solution of 2%-HF and 2%-H2O2 as specified by ISO standard.
We guarantee the metallic impurities below 10ppt for each metal.
(Specification)
TAMAPURE-AA SSX Specification Sheet
